Introduction

智能嵌入式系统设计大赛是依托IEEE国际元计算大会(IEEE ICMC)举办的一场挑战竞赛。 本次比赛致力于推动国产化人工智能平台的发展,培养学生嵌入式人工智能的系统设计能力。 本届比赛要求参赛队伍针对真实世界的医疗难题,在国产龙芯开发板上实现基于人工智能算法的解决方案(注册并完成资质验证的队伍,开发板将由龙芯邮寄提供)。 该比赛向全球各地的团队开放,成绩优异的团队将被邀请参加ICMC大会以展示他们的解决方案并颁发奖项。

Intelligent Embedded System Design Contest at ICMC is a challenging research and development competition, focusing on real-world problems that requires the implementation of machine learning algorithms on Loongson development board. It is open to multi-person teams world-wide. The top teams will be invited to the 1st IEEE International Conference on Meta Computing (IEEE ICMC) to present their solutions, and to receive their awards.

大赛日程 (Tentative Schedule)

发布日期 (Contest release date)
April 26, 2024
报名截止 (Registration deadline)
May 10, 2024 May 24, 2024
最终提交截止日期 (Final submission due)
June 10, 2024
通知成绩优异队伍现场展示 (Top teams notified for presentation)
June 15, 2024
现场展示与获奖名单公布 (Winner announced)
June 20, 2024

奖项设置 (Awards)

一等奖 (1st Place Award)
15,000 RMB / team (团队奖励)
二等奖 (2nd Place Award)
6,000 RMB / team (团队奖励)
三等奖 (3rd Place Award)
1,000 RMB / team (团队奖励)

报名规则 (Registration Rules)

报名遵循先到先得原则,一个学校最多报名2支队伍。每支队伍应有1位指导老师,指导不超过4位学生。

Registration follows the first-come-first-served principle, with a maximum of 2 teams per school. Each team should have 1 instructor to guide no more than 4 students.

获奖规则(Award Rules):

算法得分部分成绩优异的参赛队伍将会收到ICMC大会邀请,受邀的参赛队伍将进行20分钟的现场答辩,包括PPT陈述、演示、测试(共计15分钟)和专家提问(5分钟)。评审专家将对每项作品实行分项打分并集体讨论,最终获奖队伍的判定将由算法得分和答辩得分共同决定,即以获奖为目标的参赛队伍必须参加现场答辩以获得20%的答辩分数。

Invited participants will conduct on-site presentation lasting for 20 minutes, which includes a PPT presentation, demonstration, testing (totaling 15 minutes), and expert questioning (5 minutes). Evaluation experts will score each work separately and hold collective discussions. The final ranking is determined by the scores of the project and the presentation, i.e., teams aiming to win a prize must participate in the on-site presentation to get the presentation score which occupied 20% of totals.

Contest Organizers

  • Zhenge Jia (Shandong University, CN)
  • Zhaoyan Shen (Shandong University, CN)
  • Mengying Zhao (Shandong University, CN)
  • Xiaojun Cai (Shandong University, CN)

通知发布群


技术支持

为解答各参赛队伍遇到的相关技术问题,组委会将在北京时间2024年6月3日进行线上培训,具体信息如下:
会议主题:2024IESD智能嵌入式系统设计大赛线上培训
会议时间:2024/06/03 19:00-22:00 (GMT+08:00) 中国标准时间 - 北京
点击链接入会,或添加至会议列表:
https://meeting.tencent.com/dm/BRNdzLRYaiiF
#腾讯会议:982-947-035

另外提供开发板使用入门视频:
https://www.bilibili.com/video/BV1fu411x7NS/?share_source=copy_web&vd_source=8a1696b9803b1f2d227827b575b8b22d

Sponsor

  • 山东大学计算机科学与技术学院 School of Computer Science and Technology, Shandong University
  • 山东大学 Shandong University
  • 龙芯中科 Loongson Technology
  • 浪潮云 Inspur Cloud Information Technology Co., Ltd.
  • 电气与电子工程师协会 IEEE